Blake H, Author at ViaLa - Page 6 of 11

HEVC Patent Enforcement Actions Settled

DENVER, CO, US – 20 April 2023 – MPEG LA, LLC today announced that the HEVC enforcement actions brought in Landgericht Düsseldorf, Germany against Samsung Electronics GmbH (“Samsung”) announced on 28 March 2022 (see here) have been settled with the taking of licenses. As a result, all legal disputes related to those patent enforcement actions…

Heath Hoglund Speaks at LESI 2023 Annual Conference

TCL Joins Via Licensing’s Advanced Audio Coding Patent Pool

Fraunhofer and IP Bridge Join LTE Pool, Further Expanding International Impact of Via’s Collaborative Licensing Patent Program

Tom Chia Speaks at Corporate IP Strategy Conference 2017

Tom Chia Speaks at Licensing Executives Society 2020

Tom Chia Moderates Panel at Berkeley-Tsinghua Conference on Transnational IP Litigation 2021

Tom Chia Speaks at IP Counsel Café Spring Meeting 2021

Tom Chia Speaks at IP Counsel Café 2022

Tom Chia Moderates Panel at Berkeley-Tsinghua Conference on Transnational IP Litigation 2019

IPBC Global 2017